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IC Packaging Lead Frame Multi Cavity Mold
  • IC Packaging Lead Frame Multi Cavity MoldIC Packaging Lead Frame Multi Cavity Mold

IC Packaging Lead Frame Multi Cavity Mold

XP Mold is a leading IC packaging lead frame multi cavity mold manufacturer and supplier in China. Our team, renowned for their expertise in IC packaging lead frame molds, ensures that every product meets the highest standards of precision and durability.

What is IC Packaging Lead Frame Multi Cavity Mold?

IC packaging Lead Frame Mold are molds or models used for manufacturing IC packaging substrates. These molds are precisely processed and manufactured according to specific design requirements, ensuring that the produced IC packaging substrates have high precision, high density, miniaturization, and thinness. These characteristics are essential to meet the demands of integrated circuit packaging.


What is a Multi-Cavity Mold?

Multi-cavity mold has multiple cavities within the mold. These cavities allow for the simultaneous production of multiple identical or different plastic parts. The primary purpose of designing multi-cavity molds is to enhance production efficiency and output while reducing manufacturing costs.


What kind of Injection mold does IC Packaging Lead Frame Mold refer to ?

IC packaging lead frame mold is a special Insert Mold and Multi cavity mold.


Features of Multi-Cavity Molds in LED Lead Frame Molds

Compared to standard multi-cavity molds, those used in IC packaging Lead Frame molds have a higher number of cavities, more complex designs, and higher precision requirements. The manufacturing equipment for these molds demands greater accuracy, and factories need to possess skilled and advanced techniques and experience.


Application for IC Packaging Lead Frame Mold :

IC packaging substrates are widely used in downstream applications such as mobile terminals, communication devices, and servers/storage. With the continuous development of technologies like 5G, the Internet of Things (IoT), and artificial intelligence (AI), the performance and packaging requirements for integrated circuits are becoming increasingly demanding. Consequently, the demand for IC packaging substrates is also continually rising.


Our Capabilities

A common multi-cavity mold is 2-128 cavities, Our team can design molds with up to 5000 cavities,not 500 cavities very surprised ? yes, we could achieve perfect injection and cooling, which significantly reduces production costs. We are experts in IC packaging lead frame plastic molds, leading the industry in China and globally far away .

Let’s be a partner to provide you with the most perfect solution!


Hot Tags: IC Packaging Lead Frame Multi Cavity Mold, China, Manufacturer, Supplier, Factory, Customized, Classy, High Precision
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Contact Info
  • Address

    No.14, Dashan East Street, Xiagang Area, Chang’an Town, Dongguan City, Guangdong Province, China 523865

For inquiries about LED lead frame mold, multi cavity mold, optical mold or price list, please leave your email to us and we will be in touch within 24 hours.
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